IC package with embedded transformer

ABSTRACT

Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a multi-layer IC package bonded to an IC may be configured, via logic, circuitry, and/or code in the IC, based on signal levels at one or more terminals of the transformer. The transformer may comprise a plurality of inductive loops fabricated in transmission line media. The integrated circuit may be flip-chip bonded to the multi-layer package. The IC may comprise a signal strength indicator enabled to measure signal levels input to or output by the transformer. The windings ratio may be configured via one or more switches in the IC and/or in the multi-layer package. The IC and/or the multi-layer package may comprise ferromagnetic material which may improve magnetic coupling of the transformer.

This is a continuation of application Ser. No. 12/057,714 filed Mar. 28,2008.

CROSS-REFERENCE TO RELATED APPLICATIONS/INCORPORATION BY REFERENCE

This application claims the benefit of priority under 35 U.S.C. §120from U.S. patent application Ser. No. 12/057,714, filed Mar. 28, 2008,entitled “IC Package with Embedded Transformer,” and now U.S. Pat. No.8,198,714, which is incorporated herein by reference in its entirety.

FIELD OF THE INVENTION

Certain embodiments of the invention relate to signal processing. Morespecifically, certain embodiments of the invention relate to a methodand system for configuring a transformer embedded in a multi-layer ICpackage.

BACKGROUND OF THE INVENTION

Mobile communications have changed the way people communicate and mobilephones have been transformed from a luxury item to an essential part ofevery day life. The use of mobile phones is today dictated by socialsituations, rather than hampered by location or technology. While voiceconnections fulfill the basic need to communicate, and mobile voiceconnections continue to filter even further into the fabric of every daylife, the mobile Internet is the next step in the mobile communicationrevolution. The mobile Internet is poised to become a common source ofeveryday information, and easy, versatile mobile access to this datawill be taken for granted.

As the number of electronic devices enabled for wireline and/or mobilecommunications continues to increase, significant efforts exist withregard to making such devices more power efficient. For example, a largepercentage of communications devices are mobile wireless devices andthus often operate on battery power. Additionally, transmit and/orreceive circuitry within such mobile wireless devices often account fora significant portion of the power consumed within these devices.Moreover, in some conventional communication systems, transmittersand/or receivers are often power inefficient in comparison to otherblocks of the portable communication devices. Accordingly, thesetransmitters and/or receivers have a significant impact on battery lifefor these mobile wireless devices.

Further limitations and disadvantages of conventional and traditionalapproaches will become apparent to one of skill in the art, throughcomparison of such systems with some aspects of the present invention asset forth in the remainder of the present application with reference tothe drawings.

BRIEF SUMMARY OF THE INVENTION

A system and/or method is provided for configuring a transformerembedded in a multi-layer IC package, substantially as shown in and/ordescribed in connection with at least one of the figures, as set forthmore completely in the claims.

These and other advantages, aspects and novel features of the presentinvention, as well as details of an illustrated embodiment thereof, willbe more fully understood from the following description and drawings.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1A is a diagram of a hybrid circuit comprising a transformerembedded in a multi-layer integrated circuit (IC) package, in accordancewith an embodiment of the invention.

FIG. 1B is a diagram of a transformer with configurable windings ratio,in accordance with an embodiment of the invention.

FIG. 2A is a diagram illustrating a cross sectional view of amulti-layer package with embedded transformer, in accordance with anembodiment of the invention.

FIG. 2B is an exemplary top view of a transformer embedded in amulti-layer IC package, in accordance with an embodiment of theinvention.

FIG. 3 is a flow chart illustrating exemplary steps for configuring atransformer embedded in a multi-layer IC package, in accordance with anembodiment of the invention.

FIG. 4 is a block diagram illustrating an exemplary wireless device, inaccordance with an embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

Certain embodiments of the invention may be found in a method and systemfor configuring a transformer embedded in a multi-layer IC package. Invarious embodiments of the invention, a windings ratio of a transformerembedded in a multi-layer IC package may be configured, via logic,circuitry, and/or code in an IC bonded to the package, based on signallevels at a winding of the transformer. The transformer may comprise aplurality of inductive loops fabricated in a plurality of metal layersof the multi-layer package. The loops may be fabricated in transmissionline media such as microstrip and/or stripline. The integrated circuit(IC) may be flip-chip bonded to the multi-layer package and may compriseone or more amplifiers communicatively coupled to the transformer. Theintegrated circuit may comprise a signal strength indicator enabled tomeasure signal levels at a primary and/or secondary winding of thetransformer. A windings ratio of the transformer may be configured viaone or more switches which may comprise active devices in the IC and/ormicroelectromechanical (MEMS) switches in the multi-layer package. TheIC and/or the multi-layer package may comprise ferromagnetic materialwhich may, for example, improve magnetic coupling of the transformer.

FIG. 1A is a diagram of a hybrid circuit comprising a transformerembedded in a multi-layer integrated circuit (IC) package, in accordancewith an embodiment of the invention. Referring to FIG. 1A there is showna hybrid circuit 100 (may also be referred to as a hybridized circuit,or a hybrid or hybridized package) comprising an IC 106 and amulti-layer IC package 104. The IC 106 may be flip chip bonded (alsoreferred to as bump bonded) to the multi-layer IC package. The IC maycomprise a transceiver 423 and a signal strength indicator (SSI) 102.The multi-layer IC package 104 may comprise a transformer 112 and anantenna 421. In various other embodiments of the invention, the antenna421 may be separate from the hybrid circuit 100. Although a singletransceiver 423 is illustrated, the invention is not so limited.Accordingly, a separate transmitter and/or receiver may be utilizedwithout departing from the scope of the invention.

The IC 106 may comprise suitable logic, circuitry, and/or code forperforming one or more functions associated with transmitting and/orreceiving RF signals. In this regard, the IC 106 may comprise all or aportion of the system 420 described with respect to FIG. 4. The IC 106may utilize a transformer embedded in the multi-layer integrated circuitpackage 104 for transmitting and/or receiving RF signals. In thisregard, the transformer 112 may enable coupling signals to betransmitted from the transceiver 423 to the antenna 421 and couplingsignals received by the antenna 421 to the transceiver 423. In variousembodiments of the invention, the windings ratio of the transformer maybe configurable. In this regard, the IC 106 may comprise suitable logic,circuitry and/or code for configuring the transformer 112.

The SSI 102 may comprise suitable logic, circuitry, and/or code that mayenable determining signal strength. In this regard, the SSI 102 may, forexample, be enabled to measure current, voltage, and/or power of thesignal 101. Additionally, the SSI 102 may be enabled to conveymeasurement results to other portions of the IC 106. In this regard, theSSI 102 may output one or more digital and/or analog signalsrepresentative of the current, voltage, and/or power of the signal 101.The one or more signals output by the SSI 102 may be utilized by, forexample, the processor 425 described with respect to FIG. 4, to generatea control signal 103.

The multi-layer IC package 104 may comprise one or more layers of metaland/or insulating material. In this regard, the multi-layer IC package104 may be fabricated in a manner similar to or the same as the IC 106.Accordingly, circuit elements, such as resistors, inductors, capacitors,transmission lines, switches, and antennas, may be fabricated in one ormore metal layers of the multi-layer package 104. In one exemplaryembodiment of the invention, one or more switching elements and one ormore transformers may be fabricated in the multi-layer IC package 104.In this manner, a configurable transformer 112 may be realized whereinopening/closing the switches may alter the windings ratio of thetransformer 112. In other embodiments of the invention, one or moreswitching elements which may control the windings ratio of thetransformer may be fabricated in the IC 106.

The transformer 112 may comprise two or more windings and a core. Invarious embodiments of the invention, the number of loops in the primaryand/or secondary winding may be configurable. In this manner, thetransformer 112 may enable adjusting an impedance seen by signalscommunicatively coupled to the transformer 112. In this manner, voltageswings at an amplifier input and/or an amplifier output may bemaintained within determined limits. In various embodiments of theinvention, the core of the transformer 112 may comprise ferromagneticmaterial.

In operation, the transceiver may comprise a power amplifier (PA) 108which may output the signal 101 to the antenna 421 via the transformer112. In this regard, altering the windings ratio of the transformer 112may enable maintaining voltage and/or current levels of the signal 101within determined limits. In this manner, damage to circuitry in the IC106 and/or the multi-layer package 104 resulting from large voltageswings of the signal 101 may be prevented.

In operation, the transceiver 423 may comprise a low noise amplifier(LNA) 110 which may receive the signal 101 from the antenna 421 via thetransformer 112. In this regard, altering the windings ratio of thetransformer 112 may enable maintaining voltage and/or current levels ofthe signal 101 within determined limits. In this manner, damage tocircuitry in the IC 106, such as the LNA 110, and/or in the multi-layerpackage 104 resulting from large voltage swings of the signal 101 may beprevented.

FIG. 1B is a diagram of a transformer with configurable windings ratio,in accordance with an embodiment of the invention. Referring to FIG. 1Bthere is shown a transformer 112 with terminals 152 a, 152 b, 162 a, and162 b, a switch network 154, a first winding 156, a transformer core158, and a second winding 160.

The terminals 152 a and 152 b may be inputs and/or outputs to the firstwinding 156. In the exemplary embodiment of the invention depicted, thenumber of turns (also referred to as loops) between terminals 152 a and152 b may be variable. The terminals 162 a and 162 b may be the inputsand/or outputs to the second winding 160. In the exemplary embodiment ofthe invention depicted, the number of turns (loops) between theterminals 162 a and 162 b may be fixed.

The switch network 154 may comprise suitable logic, circuitry, and/orcode for communicatively coupling the terminals 152 a and 152 b to oneor more turns of the first winding 156. The switch network 154 may becontrolled via one or more control signals from, for example, theprocessor 425 and/or the baseband processor 427 described with respectto FIG. 4. In the exemplary embodiment of the invention depicted, theswitches, within the switch network 154, in the position indicated bythe solid lines may result in three turns between the terminals 152 aand 152 b, whereas the switches in the position indicated by the dashedlines may result in one turn between the terminals 152 a and 152 b. Inthe exemplary embodiment of the invention depicted, the winding 160 hastwo turns. Thus, the windings ratio is configurable between 3:2 and 1:2(first winding:second winding).

The transformer core 518 may comprise a material suitable forconcentrating the flux generated by one winding to induce a current inthe other winding. In various exemplary embodiments of the invention,the core may comprise ferromagnetic material within the multi-layer ICpackage 104.

In various embodiments of the invention, the first winding 156 may bethe primary winding or the secondary winding, and the second winding 160may be the secondary winding or the primary winding. Additionally, bothwindings may comprise a variable number of turns configured via one ormore switch networks.

In operation, the control signal may configure the switch network 154based on, for example, voltage and/or current levels at the terminals152 a, 152 b and terminals 162 a, 162 b. For example, for the terminal152 a, 152 b may be communicatively coupled to a power amplifier and theterminals 162 a, 162 b may be coupled to an antenna. Accordingly, theswitches may be in the dashed line configuration for high output powerand the switches may be in the solid line configuration for low PAoutput power. In this manner, the voltage swing at the output of the PAmay be maintained, for example, within safe levels so as not to damageCMOS circuitry.

FIG. 2A is a diagram illustrating a cross sectional view of amulti-layer package with embedded transformer, in accordance with anembodiment of the invention. Referring to FIG. 2, there is shown ahybrid circuit 100 comprising an IC 106 and a multi-layer IC package104. The multi-layer IC package 104 may comprise an insulating material203; metal layers 202; vias 220 a, 220 b(not shown), 222 a, 222 b(notshown), 224, and 226; and MEMS switches 154. Additionally, in variousembodiments of the invention, the multi-layer IC package 104 maycomprise one or more layers and/or areas of ferromagnetic and/orferrimagnetic material. The IC 106 may be coupled to the multi-layer ICpackage 104, and the package 104 to a PCB (not shown), via solder balls208. Surface mount component(s) 252 may be mounted to the multi-layer ICpackage 104, and thermal epoxy 214 may be pressed between the IC 106 andthe multi-layer IC package 104.

The IC 106 may be as described with respect to FIG. 1. Additionally, theIC 106 may be flip-chip bonded (also referred to as bump bonded) to themulti-layer IC package 104 utilizing solder balls (e.g. solder balls 208as described with respect to FIG. 2A below). In this manner, wire bondsconnecting the IC 106 to the multi-layer IC package 104 may beeliminated, reducing and/or eliminating stray inductances due to wirebonds. In addition, the thermal conductance out of the IC 106 may begreatly improved utilizing the solder balls 208 and the thermal epoxy214. The thermal epoxy 214 may be electrically insulating but thermallyconductive to allow for thermal energy to be conducted out of the IC 106to the much larger thermal mass of the multilayer package 104.

The solder balls 208 may comprise spherical balls of metal to provideelectrical, thermal and physical contact between the IC 106 and themulti-layer IC package 104. In making the contact with the solder balls208, the IC 106 may be pressed with enough force to squash the metalspheres somewhat, and may be performed at an elevated temperature toprovide suitable electrical resistance and physical bond strength. Thesolder balls 208 may also be utilized to provide electrical, thermal andphysical contact between the multi-layer IC package 104 and a printedcircuit board comprising other parts of, for example, the wirelesssystem 420 described with respect to FIG. 4.

The surface mount device(s) 252 may comprise discrete circuit element(s)such as resistors, capacitors, inductors, and diodes, for example. Thesurface mount device(s) 252 may be soldered to the multi-layer ICpackage 104 to provide electrical contact. In various embodiments of theinvention, additional surface mount elements or no surface mountelements may be coupled to the multi-layer IC package 104.

In an exemplary embodiment of the invention, the metal layer 202, mayeach comprise a deposited metal layer utilized to delineate the twotransformer windings 156 (comprised of loops 156 ₁, 156 ₂, and 156 ₃)and 160 (comprised of loops 160 ₁, 160 ₂) described with respect to FIG.1B and the antenna 421 described with respect to FIG. 4. In this regard,the metal layer 202 may be deposited in shapes and/or sizes which mayenable varying characteristics of the transformer 112 and the antenna421.

In an exemplary embodiment of the invention, the vias 220 a, 220 b (notshown), 222 a, 222 b (not shown) may comprise metal and/or otherconductive material(s) which may communicatively couple the metal layers202 to one another and to the solder balls 208. In this manner, signalsmay be conveyed to and/or from the transformer windings 156 and 160, theIC 106, and the antenna 421. In the exemplary embodiment of theinvention depicted, vias 220 a 222 a may communicatively couple positiveterminals of loops 156 ₁, 156 ₂, and 156 ₃ and vias 220 b and 222 b (notshown) may couple negative terminals of loops 156 ₁, 156 ₂, and 156 ₃.Similarly, via 224 may connect a negative terminal of loop 160 ₁ to apositive terminal of loop 160 ₂. In various other embodiments of theinvention, additional and/or alternative vias may communicatively couplethe transformer loops to each other and/or to the IC 106.

In an exemplary embodiment of the invention, the switch network 154described with respect to FIG. 1B may be implemented as MEMS switches inthe multi-layer IC package 104. In this regard, the MEMS switches 154may close when, for example a magnetic field is induced on a switchterminal. In this regard, the MEMS switches 154 may each comprise a thinconductive element or film which in the open position is suspended abovea switch terminal (as indicated by the solid lines in FIG. 2) and in theclosed position is in contact with a switch terminal (as indicated bythe dashed lines in FIG. 2). Accordingly, energizing the terminal, forexample, may generate an attracting force that draws the element of filminto contact with the terminal. In various other embodiments of theinvention, the transformer may be configured via one or more switchesintegrated on the IC 106.

In operation, the IC 106 and associated multi-layer IC package 104 maybe utilized to transmit and/or receive RF signals. The IC 106 may beelectrically coupled to the antenna 421 embedded on and/or within themulti-layer IC package 104 via a configurable transformer embedded onand/or within the multi-layer IC package 104. The windings ratio of thetransformer may be configured via the switch network 154. In thisregard, when both switches are closed the windings ratio may be 3:2,when one switch is open the windings ratio may be 2:2, and when bothswitches are open the windings ratio may be 1:2. Logic, circuitry,and/or code in the IC 106 may control the switches 154. In variousembodiments of the invention, additional devices (e.g., capacitors,inductors, resistors) may be integrated into the multi-layer IC packagewithout deviating from the scope of the present invention. Additionally,although a transformer comprising five loops is depicted, variousexemplary embodiments of the invention may comprise any number of metallayers, transformer loops, and/or switching elements without deviatingfrom the scope of the invention.

FIG. 2B is an exemplary top view of a transformer embedded in amulti-layer IC package, in accordance with an embodiment of theinvention. Referring to FIG. 2B there is shown a multi-layer IC package104, with embedded transformer. In this regard, FIG. 2B may be analternate view of the transformer 112 described with respect to FIGS.1A, 1B and 2A. Shown in FIG. 2B, but not depicted in FIG. 2A, are theterminal 250 and the capacitors 252 a, 252 b, and 252 c.

The terminal 250 may provide a tap into the winding 156 such that a DCbias may be applied to the winding. In this regard, a DC bias applied tothe center of the winding 156 may be utilized, for example, when abalanced (differential) signal is communicatively coupled to the winding156.

The capacitors 252 a, 252 b, 252 c may be bypass capacitors to ground,which may be communicatively coupled to the terminals 152 a and 152 b ofthe winding 156 and communicatively coupled to the positive terminal 226of the winding 160. The antenna 421 of FIG. 2A is not shown in FIG. 2B.

FIG. 3 is a flow chart illustrating exemplary steps for configuring atransformer embedded in a multi-layer IC package, in accordance with anembodiment of the invention. Referring to FIG. 3, subsequent to startstep 302, the exemplary steps may advance to step 304. In step 304,signal levels at the transformer may be measured. In an exemplaryembodiment of the invention, an output of a power amplifier, such as thePA 108 described with respect to FIG. 1A, may be coupled to a primarywinding of the transformer. Accordingly, the voltage across the primarywinding may be measured. In another exemplary embodiment of theinvention, a primary winding may be coupled to an antenna such as theantenna 421 described with respect to FIG. 4, and a secondary windingmay be coupled to a low noise amplifier, such as the LNA 110 describedwith respect to FIG. 1A. Accordingly, voltage across the secondarywinding may be measured. Measurements performed in step 304 may beperformed by a SSI such as the SSI 102 described with respect to FIG. 1.Additionally, measurement results may be conveyed to, for example, amemory and/or a processor, such that one or more control signals may begenerated for configuring the transformer. Subsequent to step 304, theexemplary steps may advance to step 306. In step 306, the windings ratioof the transformer may be adjusted such that the measured voltage levelsare within determined limits. In this regard, in instances that thevoltage across primary winding is too high, a lower windings ratio maybe selected. Conversely, in instances that the voltage across theprimary winding is too low, a higher windings ratio may be selected.Subsequent to step 306, the exemplary steps may advance to step 308. Instep 308, signals may be received from and/or transmitted to an antennavia the configured transformer.

FIG. 4 is a block diagram illustrating an exemplary wireless device, inaccordance with an embodiment of the invention. Referring to FIG. 4,there is shown a wireless device 420 that may comprise an RF transceiver423, a digital baseband processor 429, a processor 425, and a memory427. The transceiver 423 may comprise a receiver 423 a and a transmitter423 b. An antenna 421 may be communicatively coupled to the RFtransceiver 423 via the transformer 112. The wireless device 420 may beoperated in a system, such as the cellular network and/or digital videobroadcast network, for example.

In an exemplary embodiment of the invention, the antenna 421 maycomprise one or more antenna elements which may be coupled and/ordecoupled via one or more switching elements. In this regard, theantenna 421 may be configured based on factors comprising frequency,polarization, and/or gain. In another exemplary embodiment of theinvention, the antenna 421 may be a phased array antenna. In thisregard, the directivity of the antenna may be controlled by adjustingthe phase(s) of signals communicatively coupled to the antenna.

The RF receiver 423 a may comprise suitable logic, circuitry, and/orcode that may enable processing of received RF signals. The RF receiver423 a may enable receiving RF signals in a plurality of frequency bands.For example, the RF receiver 423 a may enable receiving signals inextremely high frequency (e.g., 60 GHz) bands. The receiver 423 a may beenabled to receive, filter, amplify, down-convert, and/or perform analogto digital conversion. The RF receiver 423 a may down convert a receivedRF signal. In this regard, the RF receiver 423 a may perform direct downconversion of the received RF signal to a baseband or may convert thereceived RF signal to an intermediate frequency (IF). In variousembodiments of the invention, the receiver 423 a may perform quadraturedown-conversion where in-phase components and quadrature phasecomponents may be processed in parallel. The receiver 423 a may beenabled to receive signals via the transformer 112, which may beconfigurable and provide a means of controlling signal levels at itsprimary and/or secondary windings. In various embodiments of theinvention, the wireless device 420 may comprise a plurality of thereceivers 423 a and may thus support multiple frequency bands and orsimultaneous reception of signals in the same frequency band.

The digital baseband processor 429 may comprise suitable logic,circuitry, and/or code that may enable processing and/or handling ofbaseband signals. In this regard, the digital baseband processor 429 mayprocess or handle signals received from the RF receiver 423 a and/orsignals to be transferred to the RF transmitter 423 b, when the RFtransmitter 423 b is present, for transmission to the network. Thedigital baseband processor 429 may also provide control and/or feedbackinformation to the RF receiver 423 a and to the RF transmitter 423 bbased on information from the processed signals. In this regard, thebaseband processor 429 may provide one or more control signals forconfiguring the transformer 112 via one or more switching elements. Thedigital baseband processor 429 may communicate information and/or datafrom the processed signals to the processor 425 and/or to the memory427. Moreover, the digital baseband processor 429 may receiveinformation from the processor 425 and/or to the memory 427, which maybe processed and transferred to the RF transmitter 423 b fortransmission to the network.

The RF transmitter 423 b may comprise suitable logic, circuitry, and/orcode that may enable processing of RF signals for transmission. Thetransmitter 423 b may be enabled to transmit signals via the transformer112, which may be configurable and provide a means of controlling signallevels at its primary and/or secondary windings. The RF transmitter 423b may enable transmission of RF signals in a plurality of frequencybands. For example, the RF transmitter 423 b may enable transmittingsignals in cellular frequency bands. Each frequency band supported bythe RF transmitter 423 b may have a corresponding front-end circuit forhandling amplification and up conversion operations, for example. Inthis regard, the RF transmitter 423 b may be referred to as a multi-bandtransmitter when it supports more than one frequency band. In anotherembodiment of the invention, the wireless device 420 may comprise morethan one RF transmitter 423 b, wherein each of the RF transmitter 423 bmay be a single-band or a multi-band transmitter.

In various embodiments of the invention, the RF transmitter 423 b mayperform direct up conversion of the baseband signal to an RF signal. Insome instances, the RF transmitter 423 b may enable digital-to-analogconversion of the baseband signal components received from the digitalbaseband processor 429 before up conversion. In other instances, the RFtransmitter 423 b may receive baseband signal components in analog form.

The processor 425 may comprise suitable logic, circuitry, and/or codethat may enable control and/or data processing operations for thewireless device 420. The processor 425 may be utilized to control atleast a portion of the RF receiver 423 a, the RF transmitter 423 b, thedigital baseband processor 429, and/or the memory 427. In this regard,the processor 425 may generate at least one signal for controllingoperations within the wireless device 420. In this regard, the basebandprocessor 429 may provide one or more control signals for configuringthe transformer 112 via one or more switching elements. The processor425 may also enable executing of applications that may be utilized bythe wireless device 420. For example, the processor 425 may executeapplications that may enable displaying and/or interacting with contentreceived via cellular transmission signals in the wireless device 420.

The memory 427 may comprise suitable logic, circuitry, and/or code thatmay enable storage of data and/or other information utilized by thewireless device 420. For example, the memory 427 may be utilized forstoring processed data generated by the digital baseband processor 429and/or the processor 425. The memory 427 may also be utilized to storeinformation, such as configuration information, that may be utilized tocontrol the operation of at least one block in the wireless device 420.For example, the memory 427 may comprise information necessary toconfigure the transformer 112. In this regard, the memory may storecontrol and/or configuration information for configuring the windingsratio of the transformer 112 via one or more switching elements.

Aspects of a method and system for configuring a transformer embedded ina multi-layer integrated circuit package are provided. In variousembodiments of the invention, a windings ratio of a transformer, such asthe transformer 112, embedded in a multi-layer IC package, such as theIC package 104, may be configured; via logic, circuitry, and/or code inan IC, such as the IC 106; based on signal levels at one or moreterminals of the transformer. The transformer 112 may comprise aplurality of inductive loops fabricated in a plurality of metal layers,such as the loops 156 and 160 described with respect to FIG. 2A, of theIC package 104. The loops 156 and/or 160 may be fabricated intransmission line media such as microstrip and/or stripline. The IC 106,may be flip-chip bonded to the IC package and may comprise one or moreamplifiers, such as the PA 108 and the LNA 110, communicatively coupledto the transformer 112 and/or a signal strength indicator, such as theSSI 102, enabled to measure signal levels input to or output by thetransformer. The windings ratio may be configured via one or moreswitches, such as the switching element 154, which may comprise activedevices in the IC 106 and/or MEMS switches in the multi-layer package104. The IC 106 and/or the multi-layer package 104 may compriseferromagnetic material which may improve magnetic coupling of thetransformer.

Another embodiment of the invention may provide a machine-readablestorage, having stored thereon, a computer program having at least onecode section executable by a machine, thereby causing the machine toperform the steps as described herein for configuring a transformerembedded in a multi-layer IC package.

Accordingly, the present invention may be realized in hardware,software, or a combination of hardware and software. The presentinvention may be realized in a centralized fashion in at least onecomputer system, or in a distributed fashion where different elementsare spread across several interconnected computer systems. Any kind ofcomputer system or other apparatus adapted for carrying out the methodsdescribed herein is suited. A typical combination of hardware andsoftware may be a general-purpose computer system with a computerprogram that, when being loaded and executed, controls the computersystem such that it carries out the methods described herein.

The present invention may also be embedded in a computer programproduct, which comprises all the features enabling the implementation ofthe methods described herein, and which when loaded in a computer systemis able to carry out these methods. Computer program in the presentcontext means any expression, in any language, code or notation, of aset of instructions intended to cause a system having an informationprocessing capability to perform a particular function either directlyor after either or both of the following: a) conversion to anotherlanguage, code or notation; b) reproduction in a different materialform.

While the present invention has been described with reference to certainembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted withoutdeparting from the scope of the present invention. In addition, manymodifications may be made to adapt a particular situation or material tothe teachings of the present invention without departing from its scope.Therefore, it is intended that the present invention not be limited tothe particular embodiment disclosed, but that the present invention willinclude all embodiments falling within the scope of the appended claims.

What is claimed is:
 1. A multi-layer package comprising: an integratedcircuit flip-chip comprising one or more circuits; and an embeddedtransformer having a primary winding and a secondary winding with aconfigurable winding ratio, wherein said one or more circuits compriseone or more switching elements configured to couple one or more turns ofa winding of said embedded transformer to enable configuration of theconfigurable winding ratio of said embedded transformer based on signallevels at said winding of said embedded transformer.
 2. The multi-layerpackage of claim 1, wherein said one or more circuits are enabled tomeasure said signal levels utilizing a signal strength indicator in saidintegrated circuit.
 3. The multi-layer package of claim 1, wherein saidwinding comprises said primary winding, and is communicatively coupledto an output of an amplifier.
 4. The multi-layer package of claim 1,wherein said winding is communicatively coupled to an input of anamplifier.
 5. The multi-layer package of claim 1, wherein said one ormore switching elements are configured to facilitate enabling adjustmentof an impedance seen by signals to be communicatively coupled to saidembedded transformer.
 6. The multi-layer package of claim 5, whereinsaid one or more switching elements comprise microelectromechanicalsystem (MEMS) switches within said multi-layer package.
 7. Themulti-layer package of claim 5, wherein said one or more switchingelements comprise microelectromechanical system (MEMS) switches oversaid multi-layer package.
 8. The multi-layer package of claim 5, whereinsaid one or more switching elements comprise active devices fabricatedwithin said integrated circuit.
 9. The multi-layer package of claim 5,wherein said one or more switching elements comprise active devicesfabricated over said integrated circuit.
 10. The multi-layer package ofclaim 1, wherein said embedded transformer comprises a plurality ofloops fabricated in a plurality of metal layers in said multi-layerpackage.
 11. The multi-layer package of claim 10, wherein said pluralityof loops are fabricated in transmission line media.
 12. The multi-layerpackage of claim 1, wherein ferromagnetic material is embedded in saidmulti-layer package.